99.999% High Purity Sputtering Titanium Target Gr1 Experimental Elemental Titanium

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99.999% High Purity Sputtering Titanium Target Gr1 Experimental Elemental Titanium
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Features
Specifications
Name: Titanium Sputtering Target High Purity Titanium Target
Key Words: Titanium Sputtering Target
Application: Coating, Electronics Industry
Grade: Gr1 TA1 Pure
Density: 4.51g/cm3
Purity: 99.9%-99.999%
Purity 1: 2N8-4N
Material: Titanium
High Light:

High Purity Titanium Target

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Experimental Elemental Titanium Target

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Gr1 Magnetron Titanium Sputtering Target

Basic Infomation
Place of Origin: China
Brand Name: N/M
Certification: ISO9001:2015 certification
Model Number: CDX-20220331D
Payment & Shipping Terms
Packaging Details: plywood case
Delivery Time: 5-35 working days
Supply Ability: 50000KG/month
Product Description

Titanium target 99.999% high-purity sputtering target experimental elemental titanium

 

Customized Titanium Target Titanium Round Target

99.999% High Purity Sputtering Titanium Target Gr1 Experimental Elemental Titanium 099.999% High Purity Sputtering Titanium Target Gr1 Experimental Elemental Titanium 1

99.999% High Purity Sputtering Titanium Target Gr1 Experimental Elemental Titanium 2

 

product Pure titanium (TI) target)
purity 2N8-4N
density 4.51g/cm3
Coating dominant color Gold Blue / Rose Red / black
shape cylindrical
General size Diameter 60/65/95/100*30/32/40/45mm

 

 


Usually we will provide a quality inspection report like this with the goods,

which shows the chemical composition and physical properties

99.999% High Purity Sputtering Titanium Target Gr1 Experimental Elemental Titanium 3

Titanium square target, titanium round target, titanium special shape target

 

Purity is one of the target performance indicators.

 

The purity of the target material has a great effect on the performance of the film.

 

Main performance requirements for targets:

Purity

Purity of the target is one of the main performance indicators of the target because the purity of the target greatly affects the performance of the film. However, in actual applications, the requirements for purity of the target material are not the same. For example, with the rapid development of the microelectronics industry The size of the silicon wafer was expanded from 6 ", 8" to 12 ", the wiring width was reduced from 0.5 um to 0.25 um, 0.18 um, and 0.13 um. Previously, the target purity was 99.995%.

Impurity content

The main source of the deposited film is the oxygen and moisture of the target solids and pores. Targets for various applications have different requirements for different impurity levels. For example, targets of pure aluminum and aluminum alloys used in the semiconductor industry have special requirements for alkali metal content and radioactive element content.

Density

In order to reduce the pores of the target solids and improve the performance of sputtered films, the targets typically need to be more densely. The target density affects not only the sputtering rate but also the electrical and optical properties of the film. The higher the target density, the better the film performance. In addition, when the target density and intensity are raised, the target can withstand the thermal stress during sputtering. Density is one of the target performance indicators.

Grain size and size distribution

Usually the target is polycrystalline, and the particle size may be in the order of micrometers to millimeter. In the case of the same target, the sputtering rate of the fine-grained target is faster than the sputtering rate of the coarse grained target, while sputter deposition of the smaller particle size (uniform distribution) target has a uniform thickness distribution (uniform). Distribution.

 

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